Capabilities that allow us to create innovative products and solutions
Photolithography
Our photolithography capabilities include positive and negative photoresists, which allow us to create high-density, high-performance circuits and devices with very small feature sizes. We can also fabricate high-aspect ratio structures and achieve precision alignment. These capabilities are critical for many advanced applications, and they enable us to provide our customers with a wide range of options to meet their specific requirements and deliver high-quality products that meet their specifications and performance.
Vias are small holes drilled or etched through a substrate to create conductive pathways between different layers of a circuit or device. Copper and gold filled vias provide reliable and low-resistance electrical connections.
At Vajra, we use copper and gold filled vias to create high-density, high-performance circuits and devices.
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Copper filled vias are a cost-effective solution for high-performance applications and are suitable for most electronic circuits.
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Gold filled vias provide a higher performance solution with low resistance and low contact resistance.
Our techniques allow us to fill vias with high aspect ratios and fine feature sizes, which are critical for many advanced applications such as: High-density packaging, High-frequency circuits, Micro-electromechanical systems (MEMS)
Copper and Gold Filled Vias
Polyimides
Polyimides are a class of thermosetting polymers that offer excellent thermal stability, chemical resistance, and mechanical properties. They are used in a wide range of applications, including electronics, aerospace, automotive, and medical devices.
At Vajra, we have used polyimides in various forms, such as polyimide films (Kapton), photosensitive and dry etch polyimides, to create multilayer flexible circuits, solder dams, passivation layers, crossovers, and other advanced applications. Our polyimide processing capabilities include precision lamination, coating, and curing. We can also process polyimides in a variety of thicknesses and configurations to meet the needs of different applications.
Overall, polyimides are a versatile material that can be used to achieve the desired outcome in a wide range of applications.
Substrates
Engineering Services
Substrate materials are the materials on which a circuit or device is built. They provide the foundation for the circuit and are responsible for the mechanical and electrical properties of the device.
At Vajra, we use a wide range of substrate sizes, shapes, and materials, including:
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Glass: Borosilicate D263 Schott, Foturan, Invenios, Photosensitive
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Ceramic: AlN, Alumina, Quartz, Sapphire
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Flexible substrates: Kapton film, Liquid Polyimide
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Titanates
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Ferrite
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Conformal Coating: Acrylic
Each substrate material has its own unique properties and can be used for different applications. For example, glass substrates are used for high-performance applications such as optical devices and micro-electromechanical systems (MEMS), while flexible substrates are used for applications that require flexibility and lightweight materials, such as flexible displays and medical devices.
Our team can help you choose the right substrate material for your specific application and provide consultation on the design and fabrication process.
We also have the capability to work with customer-supplied substrate materials.
Vajra's engineering services provide the technical support you need to design, develop, and implement your products successfully.
Our experienced team offers a wide range of services, including:
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Product design and development
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Prototyping
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Production engineering
We can cover all aspects of product development, from initial concept and design to final production. We work closely with our customers to understand their requirements and provide solutions that meet their specific needs.
Vajra: Your engineering partner for success.