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Laser Drilling Glass Vias: Ablation vs. Vaporization

Vajra Microsystems | vajramicro.com | info@vajramicro.com


Ablation is a process in which material is removed from a surface by the impact of a high-energy beam, such as a laser. The laser beam causes the material to vaporize or break up into small particles, which are then carried away by a stream of gas. Ablation can be used to create very precise holes or features in a variety of materials, including glass.


Vaporization is a process in which a material is converted from a solid to a vapor by the application of heat. In the context of laser drilling, vaporization is used to create holes in glass by focusing a laser beam on the surface of the glass and heating it to its vaporization temperature. The resulting vapor is then carried away by a stream of gas.


The choice of ablation or vaporization for laser drilling glass vias depends on a number of factors, including the desired hole size, the type of glass, and the desired surface finish. Ablation is typically used for smaller holes and for creating smooth, burr-free surfaces. Vaporization is typically used for larger holes and for creating rough surfaces that are better suited for bonding or other processes.

In both cases, it is important to carefully control the laser parameters to avoid damaging the glass or creating heat-affected zones. The laser power, pulse duration, and repetition rate should all be optimized to achieve the desired results.


Here are some additional benefits of using laser drilling to create vias in glass:

  • High precision: Laser drilling can create very precise holes with tight tolerances.

  • High speed: Laser drilling is a fast and efficient process.

  • Minimal waste: Laser drilling produces very little waste material.

  • No tooling required: Laser drilling does not require any special tooling, which can save time and money.

  • Reproducible results: Laser drilling can produce consistently reproducible results.

Overall, laser drilling is a versatile and efficient process that can be used to create vias in glass with high precision, speed, and minimal waste.

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