Journey Through Light: The Evolution of Photolithography in Microdevice Fabrication
Photolithography, akin to art, evolved from simple 1950s techniques to today's advanced EUV lithography, crafting the microdevices era
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PI 2600 Polyimide: Advancing High-Tech Industries with Exceptional Properties
PI 2600: The Versatile Material Shaping the Future of High-Tech Industries
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Innovations Shaping the Future of Conformal Coating
Tomorrow's shield for electronics: Smart, self-healing coatings with nanotech finesse. A glimpse into the future of device protection
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Kapton's Journey from Space to Medical: A Material Made for Extreme Environments
Kapton's Journey to Mars: A Material Made for Extreme Environments
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Conformal Coating Thickness: Striking the Balance for PCB Protection
Protect your PCBs, the heart of your devices, with conformal coating.
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B31 LOC Conformal Coating: A Versatile Solution for Protecting Electronic Assemblies
B31 LOC is a high-performance, low-VOC, quick-drying acrylic conformal coating developed by Chase Corporation, designed to offer superior...
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Vias: Filled or Plated Thru
Filled vias offer better electrical conductivity, thermal performance, and mechanical strength than plated through vias, but they are more e
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Exploring the Characteristics of HD-8820
HD-8820, a versatile PBO precursor with impressive mechanical properties, heat resistance, low water absorption, and dielectric properties.
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Tantalum Nitride Thin Film Resistors: For High-Performance Electronics
Tantalum Nitride Thin Film Resistors: For High-Performance Electronics
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LiPON: A Promising Solid Electrolyte Material for Rechargeable Lithium-Ion Batteries
LiPON: A solid electrolyte material with high ionic conductivity, wide electrochemical voltage window, and non-flammable.
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Medical Imaging: Ultrasound Transducer Materials and Probe Construction
Ultrasound transducers convert electrical energy into sound waves and vice versa, allowing for the creation of detailed images.
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The promise of glass substrates in next-generation electronic packaging
Glass substrates are poised to play a crucial role in next-gen electronic packaging. They offer numerous advantages, including high thermal
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Conformal Coatings: Safeguarding Electronic Components
Conformal coatings protect electronic components from moisture, chemicals, vibration & shock.
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The Benefits and Challenges of Using Through Glass Vias (TGVs)
Thru glass vias (TGVs) allow for more connections between different layers of circuitry, which can lead to smaller and more powerful devices
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Glass: A Promising Substrate for Integrated Passive Devices
Glass-based IPDs are a promising technology for high-frequency applications.
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Paper-based microfluidic devices: A promising technology for point-of-care diagnostics
Paper-based microfluidic devices (μPADs) are portable, affordable, and easy-to-use devices that can be used to perform simple, rapid, and ac
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The Benefits of RDL Technology for Interposer Design
RDL technology is a key enabler for advanced interposer design. It improves signal integrity, reduces size, and increases flexibility.
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The Importance of a Large and Continuous Ground Plane for Thin Film Devices
A large and continuous ground plane is crucial for thin film devices. It minimizes impedance, reduces EMI, and mitigates signal coupling.
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Laser Drilling Glass Vias: Ablation vs. Vaporization
Laser drilling glass vias can be done via ablation or vaporization. Ablation is for small holes, vaporization for large.
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Inkjet Printing: A Promising New Method for Applying Conformal Coatings
Inkjet printing conformal coating is a precise, efficient, & environmentally friendly way to apply thin, protective coatings to electronic d
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