Harnessing plasmas for microfabrication unlocks unmatched precision in nanotech, revolutionizing electronics and beyond. #PlasmaPrecision

Filled vias offer better electrical conductivity, thermal performance, and mechanical strength than plated through vias, but they are more e

HD-8820, a versatile PBO precursor with impressive mechanical properties, heat resistance, low water absorption, and dielectric properties.

Glass substrates are poised to play a crucial role in next-gen electronic packaging. They offer numerous advantages, including high thermal

Thru glass vias (TGVs) allow for more connections between different layers of circuitry, which can lead to smaller and more powerful devices

Glass-based IPDs are a promising technology for high-frequency applications.

RDL technology is a key enabler for advanced interposer design. It improves signal integrity, reduces size, and increases flexibility.

Laser drilling glass vias can be done via ablation or vaporization. Ablation is for small holes, vaporization for large.

Lasers can induce structural changes in glass, such as crystallization, phase transitions, and network rearrangement.

Glass interposer fabrication advances enable smaller, more functional, and high-performance electronic devices. #Glass Interposer