The Versatility of Negative Photoresist
Crafting intricate designs across industries, negative photoresist shines with precision and versatility in pattern creation.
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Plasma Precision: Shaping the Future of Microfabrication
Harnessing plasmas for microfabrication unlocks unmatched precision in nanotech, revolutionizing electronics and beyond. #PlasmaPrecision
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Vias: Filled or Plated Thru
Filled vias offer better electrical conductivity, thermal performance, and mechanical strength than plated through vias, but they are more e
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Exploring the Characteristics of HD-8820
HD-8820, a versatile PBO precursor with impressive mechanical properties, heat resistance, low water absorption, and dielectric properties.
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The promise of glass substrates in next-generation electronic packaging
Glass substrates are poised to play a crucial role in next-gen electronic packaging. They offer numerous advantages, including high thermal
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The Benefits and Challenges of Using Through Glass Vias (TGVs)
Thru glass vias (TGVs) allow for more connections between different layers of circuitry, which can lead to smaller and more powerful devices
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Glass: A Promising Substrate for Integrated Passive Devices
Glass-based IPDs are a promising technology for high-frequency applications.
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The Benefits of RDL Technology for Interposer Design
RDL technology is a key enabler for advanced interposer design. It improves signal integrity, reduces size, and increases flexibility.
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Laser Drilling Glass Vias: Ablation vs. Vaporization
Laser drilling glass vias can be done via ablation or vaporization. Ablation is for small holes, vaporization for large.
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Laser-Induced Thermal & Structural Changes in Glass
Lasers can induce structural changes in glass, such as crystallization, phase transitions, and network rearrangement.
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Advancements in Glass Interposer Fabrication for Electronic Packaging
Glass interposer fabrication advances enable smaller, more functional, and high-performance electronic devices. #Glass Interposer
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